Titanium copper alloy sputtering targets are metallic alloy targets composed of titanium (Ti) and copper (Cu), combining the structural stability of titanium with the excellent electrical and thermal conductivity of copper. These targets are commonly used in physical vapor deposition (PVD) processes to prepare metal or alloy thin films with good adhesion, electrical properties, or interface control capabilities.
We offer titanium-copper alloy sputtering targets in various composition ratios and specifications, including common structural forms such as planar and circular targets, and support custom processing. We can design a target to match your sputtering equipment, target size, and application requirements. Contact us.
Titanium-copper alloy system with controllable composition
Balancing conductivity and structural stability
Suitable for DC or magnetron sputtering processes
Stable sputtering process with good film uniformity
Suitable for research and industrial deposition applications
Microelectronics and Electronic Devices: Can be used as electrode layers or functional intermediate layers in electronic devices to meet conductivity and structural requirements.
Functional Thin Films and Composite Structures: In multilayer thin film structures, titanium-copper alloy thin films are often used as transition layers or composite functional layers to improve interfacial bonding performance.
Surface Engineering and Materials Research: Suitable for studying material properties and optimizing processes under different composition ratios.
Q1: What thin film applications are Titanium Copper Alloy sputtering targets typically used for?
A1: Commonly used for depositing metal thin films, functional thin films, and transition layers, balancing conductivity and adhesion, suitable for microelectronics and engineering coatings.
Q2: What is the main role of introducing titanium in the sputtering process?
A2: Titanium helps improve the adhesion and interfacial stability between the thin film and the substrate, while also improving the consistency of the thin film structure.
Q3: What are the characteristics of the electrical properties of Titanium Copper alloy thin films?
A3: Copper provides good conductivity, while the addition of titanium can improve the stability and reliability of the thin film while ensuring conductivity.
Q4: What substrates are suitable for Titanium Copper Alloy sputtering targets?
A4: These targets are generally suitable for thin film deposition on silicon, glass, metals, and various engineering substrates.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in alloy sputtering targets and advanced thin film materials, emphasizing target density, compositional consistency, and process compatibility, providing stable and reliable material solutions for TiCu alloy thin film deposition.
Molecular Formula: TiCu
Appearance: Silver-gray target material
Density: Approx. 4.4 g/cm³
Melting Point: Approx. 1320 °C
Crystal Structure: Face-centered cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
