ULPMAT

Titanium Aluminum Silicon Alloy

Chemical Name:
Titanium Aluminum Silicon Alloy
Formula:
TiAlSi
Product No.:
22131400
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
22131400ST001 TiAlSi 99.95% Ø 152.4mm x 6.35mm Inquire
Product ID
22131400ST001
Formula
TiAlSi
Purity
99.95%
Dimension
Ø 152.4mm x 6.35mm

Titanium Aluminum Silicon Aolly Sputtering Target Overview 

Titanium Aluminum Silicon alloy Sputtering Target is a high-temperature stable titanium-aluminum-silicon alloy material, possessing both excellent conductivity and high-temperature resistance. It is widely used in the development of functional thin films, conductive ceramic coatings, high-temperature electronic devices, and scientific thin film materials.

We offer TiAlSi sputtering targets with uniform composition and dense structure, suitable for DC or RF magnetron sputtering systems. Please contact us for detailed specifications and technical information.

Product Highlights

High-Temperature Stable
Excellent Conductivity and Thermal Stability
Compositional Stability and Good Film Repeatability During Sputtering
Suitable for High-Temperature, Vacuum, and Inert Atmosphere Deposition
High Batch Consistency
Customizable Sizes and Form Factors
Suitable for Scientific and Industrial Thin Film Preparation

Applications of Titanium Aluminum Silicon Sputtering Target

Functional Thin Film Deposition: Can be used to prepare highly conductive, high-temperature resistant, and corrosion-resistant functional thin films for electronic devices and conductive coatings.
Conductive Ceramics and Composite Thin Films: Utilizing its conductivity and high-temperature stability, it can be used to prepare metal-ceramic composite thin films and high-performance conductive ceramic films.
Research and Materials Development: Widely used in the research of titanium-aluminum-silicon alloy thin films, the development of novel high-temperature materials, and film performance testing.
Corrosion-Resistant High-Temperature Coatings: TiAlSi thin films exhibit stable performance in high-temperature and corrosive environments, making them suitable for research on high-temperature resistant and protective coatings.

FAQs

Q1: Which sputtering method is suitable for TiAlSi targets?
A1: Suitable for DC magnetron sputtering and RF magnetron sputtering. It has excellent conductivity and is suitable for various PVD processes.

Q2: Is the composition of TiAlSi targets stable during sputtering?
A2: Under appropriate process conditions, the target maintains stable chemical composition, resulting in good film repeatability and consistency.

Q3: Are TiAlSi targets suitable for high-temperature deposition?
A3: Yes, the target possesses excellent thermal stability and thermal shock resistance, making it suitable for high-temperature thin film deposition.

Q4: In which areas are TiAlSi thin films mainly used?
A4: Mainly used for conductive coatings, functional thin films, high-temperature electronic devices, and the development of research thin film materials.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We specialize in the research and supply of high-performance TiAlSi sputtering targets, ensuring that our TiAlSi sputtering targets meet research and industrial standards in terms of material structure, densification, and sputtering compatibility, providing reliable assurance for thin film preparation.

Molecular formula: TiAlSi

Appearance: Silver-gray target material

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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