| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 140700ST001 | Si3N4 | 99.5% | Ø 25.4mm x 3.175 mm | Inquire |
| 140700ST002 | Si3N4 | 99.5% | Ø 25.4mm x 6.35 mm | Inquire |
| 140700ST003 | Si3N4 | 99.9% | Ø 25.4mm x 3.175 mm | Inquire |
| 140700ST004 | Si3N4 | 99.9% | Ø 25.4mm x 6.35 mm | Inquire |
| 140700ST005 | Si3N4 | 99.5% | Ø 50.8mm x 3.175 mm | Inquire |
| 140700ST006 | Si3N4 | 99.5% | Ø 50.8mm x 6.35 mm | Inquire |
| 140700ST007 | Si3N4 | 99.9% | Ø 50.8mm x 3.175 mm | Inquire |
| 140700ST008 | Si3N4 | 99.9% | Ø 50.8mm x 6.35 mm | Inquire |
| 140700ST009 | Si3N4 | 99.5% | Ø 76.2mm x 3.175 mm | Inquire |
| 140700ST010 | Si3N4 | 99.5% | Ø 76.2mm x 6.35 mm | Inquire |
| 140700ST011 | Si3N4 | 99.9% | Ø 76.2mm x 3.175 mm | Inquire |
| 140700ST012 | Si3N4 | 99.9% | Ø 76.2mm x 6.35 mm | Inquire |
| 140700ST013 | Si3N4 | 99.5% | Ø 101.6mm x 3.175 mm | Inquire |
| 140700ST014 | Si3N4 | 99.5% | Ø 101.6mm x 6.35 mm | Inquire |
| 140700ST015 | Si3N4 | 99.9% | Ø 101.6mm x 3.175 mm | Inquire |
| 140700ST016 | Si3N4 | 99.9% | Ø 101.6mm x 6.35 mm | Inquire |
| 140700ST017 | Si3N4 | 99.5% | Ø 203.2mm x 3.175 mm | Inquire |
| 140700ST018 | Si3N4 | 99.5% | Ø 203.2mm x 6.35 mm | Inquire |
| 140700ST019 | Si3N4 | 99.9% | Ø 203.2mm x 3.175 mm | Inquire |
| 140700ST020 | Si3N4 | 99.9% | Ø 203.2mm x 6.35 mm | Inquire |
| 140700ST021 | Si3N4 | 99.5% | 300mm x 186mm x 6mm | Inquire |
| 140700ST022 | Si3N4 | 99.9% | 378.2mm x 121.15mm x 6.35mm | Inquire |
| 140700ST023 | Si3N4 | 99.9% | 400mm x 289mm x 10mm | Inquire |
Silicon Nitride sputtering targets are high-performance ceramic targets characterized by extreme hardness, excellent electrical insulation, and outstanding chemical stability. Primarily used for depositing high-hardness protective coatings, semiconductor insulating layers, and special optical thin films, they are key coating materials in the fields of precision tools, microelectronics, and high-temperature devices.
We provide high-purity, high-density silicon nitride ceramic targets. We can customize various sizes and specifications according to your process requirements and offer professional metal backing plate bonding services.
Exceptional Hardness and Wear Resistance
Outstanding Electrical Insulation
Excellent Thermal Stability and Thermal Shock Resistance
High Chemical Inertness and Corrosion Resistance
Uniform and Dense Thin Films
Tool and Mold Coatings: Used for coating cutting tools and stamping dies, significantly enhancing their wear life and machining accuracy.
Semiconductor Insulating Layers: Serves as a high-quality dielectric isolation layer in integrated circuits and sensors, ensuring stable device operation.
Aerospace Component Protection: Provides high-temperature resistant and anti-oxidation protective coatings for engine components, suitable for extreme environments.
Biomedical Devices: Utilizes its good biocompatibility and chemical stability for functional coatings on the surfaces of implantable devices.
Q1: What are the purity and density of the silicon nitride target?
A1: Our products typically achieve a purity of over 99.9% and a sintering density exceeding 98% of the theoretical density, ensuring a stable sputtering process.
Q2: Which sputtering process is it mainly used for?
A2: Radio Frequency (RF) magnetron sputtering is primarily recommended, as it handles this insulating ceramic material effectively.
Q3: What shapes and bonding methods can you provide?
A3: We can provide various shapes such as circular and rectangular, and support integrated bonding with backing plates like copper or molybdenum.
Q4: What are the performance characteristics of the deposited film?
A4: The deposited silicon nitride film exhibits high hardness, good insulation, stable chemical properties, and excellent barrier performance.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in the R&D and production of high-performance ceramic sputtering targets, possessing advanced powder processing and sintering technologies. We have a deep understanding of silicon nitride material properties and can provide professional support from material selection to process parameter recommendations. By choosing us, you will receive reliable products with detailed data, along with efficient and convenient supply chain services, providing a solid foundation for your research and production.
Molecular Formula: Si3N4
Molecular Weight: 140.28 g/mol
Appearance: Light gray dense target
Melting Point: 1900 °C (decomposes)
Crystal Structure: Hexagonal (α-Si3N4); Tetragonal or rhombohedral (β-Si3N4)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
