Magnesium Aluminate sputtering targets are high-density ceramic targets based on a magnesium-aluminate spinel structure, suitable for stable thin film deposition processes. These targets are commonly used in the preparation of optical thin films, insulating coatings, and films related to high-temperature electronic materials.
We offer magnesium-aluminate spinel sputtering targets in various sizes, thicknesses, and density controls, and support backplane bonding solutions. Please contact us directly for technical and pricing information.
Stable spinel structure, excellent sputtering consistency
High target density, low risk of particle detachment
Strong thermal stability, suitable for long-term sputtering
Good electrical insulation properties, reliable film layer
Supports backplane bonding and integral processing
Compatible with various sputtering equipment requirements
Optical and Functional Thin Film Deposition: Can be used to prepare uniform and dense optical and functional thin films, meeting applications with high requirements for film stability.
Insulating Coating Preparation: Suitable for insulating film deposition in electronic devices, helping to improve device operational stability.
High-Temperature Electronic Material Films: Used in high-temperature electronic or special devices, ensuring structural stability of the film under thermal conditions.
Research and Process Validation: Suitable for sputtering process development in laboratory and pilot-scale stages, facilitating parameter optimization and material evaluation.
Q1: Does magnesium-aluminum spinel sputtering target require a backing plate?
A1: For medium to large-sized targets or long-term sputtering operations, it is generally recommended to use a metal backing plate to improve heat dissipation and operational stability.
Q2: What are some commonly used backing plate materials?
A2: Copper, aluminum, and other metal backing plates can be selected according to equipment and process requirements, and reliable bonding treatment can be performed.
Q3: Will target bonding affect sputtering performance?
A3: A proper bonding process can improve the overall stability of the target and has no adverse effect on sputtering uniformity.
Q4: Can target sizes be customized according to equipment specifications?
A4: Yes, we support customizing round, square, and other target sizes according to customer equipment parameters.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We have long focused on the preparation and bonding process control of ceramic sputtering targets, providing stable and reliable product quality and rapid technical support to help customers efficiently complete thin film preparation and equipment matching.
Molecular Formula: MgAl₂O₄
Molecular Weight: 142.28 g/mol
Appearance: White, dense target
Density: 3.58–3.60 g/cm³ (depending on densification)
Melting Point: 2135 °C
Crystal Structure: Cubic (spinel)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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