Boron

Boron sputtering targets are made from high-purity boron, typically appearing dark gray to black with a metallic luster and an atomic crystal structure. With high hardness, high melting point, and excellent chemical stability, boron targets enable the deposition of dense, uniform, and well-adhered thin films.

They are widely used in semiconductor, optoelectronic, optical coating, and hard coating applications, including the preparation of boron thin films, boride thin films (such as B₄C, TiB₂, MoB₂), and boron-doped semiconductor films. Boron targets can be manufactured in circular, rectangular, or other customized shapes to meet different process requirements.

Key Features & Advantages

High purity: Standard ≥99.5%, ultra-high purity up to ≥99.9%

Excellent physical properties: High melting point (~2076 °C), high hardness (Mohs ~9.3)

Strong chemical stability: Resistant to acids and alkalis at room temperature

Superior film quality: Produces dense, uniform films with strong adhesion

Customizable specifications: Size, shape, and purity available upon request

Applications of boron sputtering target

Semiconductor industry: boron sputtering targets are used for Boron-doped silicon films, P-type semiconductor fabrication

Optical coatings: Wear-resistant, high-temperature, anti-reflective films

Hard coatings: Production of coatings such as boron carbide (B₄C) and titanium diboride (TiB₂)

Nuclear industry: boron sputtering targets are used for Thin films with high neutron absorption capability

Handling & Storage

Use clean gloves or finger cots when handling to prevent contamination.

Store in a sealed, moisture-proof package in a cool, dry, and clean environment. Keep away from strong oxidizing agents, halogens, and sources of mechanical shock.