ULPMAT

Nickel ferrite (Nickel Iron Oxide)

Chemical Name:
Nickel ferrite (Nickel Iron Oxide)
Formula:
NiFe2O4
Product No.:
28260800
CAS No.:
12168-54-6
EINECS No.:
235-335-3
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
28260800ST001 NiFe2O4 99.9% Ø 25.4 mm x 3.175 mm Inquire
28260800ST002 NiFe2O4 99.9% Ø 50.8 mm x 3.175 mm Inquire
Product ID
28260800ST001
Formula
NiFe2O4
Purity
99.9%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
28260800ST002
Formula
NiFe2O4
Purity
99.9%
Dimension
Ø 50.8 mm x 3.175 mm

Nickel Iron Oxide Sputtering Target Overview

Nickel Iron Oxide Sputtering Target are spinel-structured oxide targets primarily used for the deposition of magnetic oxide thin films and related functional layers.

We offer high-density, compositionally stable NiFe2O4 sputtering targets, supporting customization of size and structure. Please contact us for technical parameters.

Product Highlights

Stable spinel phase structure
High target density
Good film composition consistency
Suitable for oxide sputtering processes
Good thermal stability
Customizable bonding and backplanes
Custom processing supported

Applications of Nickel Iron Oxide Sputtering Target

Magnetic Oxide Thin Films: Commonly used for depositing ferrite-based magnetic thin films, suitable for applications requiring high magnetic response stability and repeatability.
Electronic and Functional Devices: Used to form oxide functional layers with specific magnetoelectric properties in some electronic devices and functional materials.
Sensing and Magnetic Control Materials: Can be used in the preparation of magnetically sensitive or related control material thin films, meeting the requirements for controllable film structure and performance.
Research and Process Development: Suitable for experimental use in research institutions for oxide thin film structure control, sputtering parameter optimization, and new material exploration.

FAQs

Q1: Which sputtering method is suitable for NiFe2O4 sputtering targets?
A1: Can be used in conventional magnetron sputtering processes. The specific method needs to be confirmed based on equipment conditions.

Q2: Does the target require special pretreatment?
A2: Usually no complex pretreatment is required; conventional oxide target operation is sufficient.

Q3: Is the composition of the deposited film stable?
A3: Under reasonable process parameters, the film composition maintains good consistency with the target.

Q4: Do you support small-size specifications for research use?
A4: Yes, we can provide various size options suitable for R&D and experimental stages.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We have extensive experience in the preparation and processing of oxide sputtering targets, emphasizing structural stability, process adaptability, and quality consistency, which can provide reliable support for magnetic thin films and functional device applications.

Molecular Formula: NiFe₂O₄
Molecular Weight: 231.53 g/mol
Appearance: Black or dark brown target material with a smooth surface
Density: Approximately 5.2 g/cm³
Melting Point: Approximately 1,550°C
Boiling Point: Decomposition point approximately 2,500°C
Crystal Structure: Spinel structure

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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