Nickel boride sputtering targets are high-purity nickel-boron alloy materials primarily used for functional thin film deposition and high-performance electronic device manufacturing.
We offer NiB sputtering targets in various sizes, thicknesses, and structures, and support equipment matching and technical guidance. Contact us for customized solutions and technical information.
High purity and stability
High target density
Stable discharge performance
Good film uniformity
Compatible with various sputtering equipment
Customizable backplanes and bonding
Reliable batch consistency
Electronic Device Thin Film Deposition: NiB sputtering targets can be used for the preparation of conductive or functional thin films, ensuring film uniformity and stable electronic device performance.
Functional Coating Preparation: Suitable for the deposition of wear-resistant and corrosion-resistant functional coatings, improving material surface properties and lifespan.
Composite Films: Functional layers can be deposited in multilayer composite materials, improving the conductivity, hardness, and thermal stability of the composite material.
Scientific Research and Process Development: NiB targets are suitable for thin film process experiments and new material development, helping to achieve repeatable deposition results in the R&D stage.
Q1: What are the suitable applications for NiB sputtering targets?
A1: Commonly used in thin films for electronic devices, functional coatings, composite materials, and scientific research.
Q2: Can NiB targets be used in different sputtering equipment?
A2: Yes, we offer various sizes and structures compatible with mainstream sputtering systems.
Q3: Are targets prone to problems during sputtering?
A3: High-density targets ensure discharge stability and reduce deposition unevenness or target loss.
Q4: How should NiB sputtering targets be stored to ensure performance?
A4: It is recommended to store them in a dry, sealed container, avoiding impact or moisture to maintain target performance stability.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We have extensive experience in the supply of functional sputtering targets, providing high-density, high-purity NiB targets and customized services, along with comprehensive technical support, to help customers achieve stable and efficient deposition results in electronic devices and functional thin film applications.
Molecular Formula: NiB
Molecular Weight: 69.50 g/mol
Appearance: Black or dark gray metallic target, smooth surface, round or custom-shaped
Density: Approx. 7.6 g/cm³
Melting Point: Approx. 1300°C
Boiling Point: Approx. 3000°C
Crystal Structure: Hexagonal crystal structure
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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