ULPMAT

Copper Nickel Zinc Alloy

Chemical Name:
Copper Nickel Zinc Alloy
Formula:
CuNiZn
Product No.:
29283000
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
29283000ST001 CuNiZn 99.99% Ø 101.6 mm x 6.35 mm Inquire
Product ID
29283000ST001
Formula
CuNiZn
Purity
99.99%
Dimension
Ø 101.6 mm x 6.35 mm

Copper Nickel Zinc Sputtering Targets Overview 

Copper nickel zinc sputtering targets are multi-element alloy thin film deposition materials, primarily used in electronic functional thin films, decorative coatings, and related surface engineering applications.

We can provide copper nickel zinc alloy sputtering targets with controllable composition ratios and uniform microstructure, supporting customization in multiple sizes and structures. Please contact us for technical information and application solutions.

Product Highlights

Stable multi-element alloy composition
Good target density
Uniform sputtering process
Optional bonding and backplanes
Consistent film appearance
High processing precision
Wide range of applicable processes

Applications of Copper Nickel Zinc Sputtering Targets

Electronic and Functional Thin Film Preparation: This target can be used to prepare alloy thin films with stable electrical and physical properties, suitable for various electronic structure designs.
Decorative and Protective Coatings: Forms uniformly colored and well-adhesive alloy coatings through sputtering processes, commonly used for decorative and protective surface treatments.
Sensing and Device Materials Research: Suitable for sensor and device development where high control over alloy thin film composition is required.
Thin Film Processing and Materials Research: Widely used in research institutions to study the structure, properties, and process parameter relationships of multi-element alloy thin films.

FAQs

Q1: In which industries are copper nickel zinc sputtering targets mainly used?
A1: Mainly used in electronic thin films, decorative coatings, functional materials, and related scientific research applications.

Q2: Can the alloy ratio of the target be adjusted?
A2: Customized solutions with different copper, nickel, and zinc ratios can be provided according to specific application requirements.

Q3: Is the target stable during sputtering?
A3: Under reasonable process conditions, the target sputtering process is stable, which helps to obtain thin films with uniform composition.

Q4: What precautions should be taken during product storage and transportation?
A4: Sealed packaging is recommended to avoid moisture and contamination to maintain the surface condition of the target.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We have extensive experience in manufacturing alloy sputtering targets, focusing on material uniformity, processing quality, and delivery stability, enabling us to provide customers with more reliable and easily assessable thin film deposition material support.

Chemical Formula: CuNiZn

Appearance: Dense target material, silver-gray to metallic gray

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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