ULPMAT

Copper Aluminum Alloy

Chemical Name:
Copper Aluminum Alloy
Formula:
CuAl
Product No.:
291300
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
291300ST001 CuAl 99.99% Ø 76.2 mm x 6.35 mm Inquire
291300ST002 CuAl 99.99% 100 mm x 100 mm x 3 mm Inquire
Product ID
291300ST001
Formula
CuAl
Purity
99.99%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
291300ST002
Formula
CuAl
Purity
99.99%
Dimension
100 mm x 100 mm x 3 mm

Copper Aluminum Alloy Sputtering Targets Overview 

Copper aluminum alloy sputtering targets are high-performance metal targets widely used in the manufacture of conductive thin films, decorative coatings, and electronic devices to ensure film uniformity and stability.

We offer copper aluminum alloy sputtering targets in various composition ratios and sizes, supporting customized processing and technical consultation. Please contact us for solutions.

Product Highlights

High purity
High composition uniformity
Stable sputtering rate
Excellent film adhesion
Compatible with various sputtering equipment
Reliable conductivity
Supports custom circular, square, and irregular shapes and bonding

Applications of Copper Aluminum Alloy Sputtering Targets

Semiconductor Thin Film Preparation: Used to form conductive interconnect layers and functional thin films, improving device conductivity and stability.
Optoelectronics and Display Devices: Used in OLED, LCD, and touch display devices to ensure uniform and reliable conductive films.
Decorative and Functional Coatings: Suitable for metal surface decoration, corrosion resistance, and deposition of conductive functional films, enhancing product added value.

FAQs

Q1: Are copper-aluminum alloy targets suitable for DC or RF sputtering?
A1: Due to the good conductivity of the alloy, DC sputtering generally provides stable results, but RF sputtering is more suitable for the deposition of certain high-resistivity materials.

Q2: Do you support custom-made non-standard sizes of targets?
A2: Yes, we offer custom-made round, square, and irregularly shaped targets to meet different equipment and process requirements.

Q3: Do the targets require special maintenance during use?
A3: We recommend regularly checking the integrity and cleanliness of the target surface to prevent impurities from adhering and to ensure the quality of the deposited film.

Q4: Does the copper aluminum alloy ratio affect the film performance?
A4: Yes, different copper-aluminum ratios will affect conductivity, film hardness, and deposition rate. An appropriate ratio should be selected according to process requirements.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We specialize in the production and supply of high-performance metal alloy targets, strictly controlling compositional uniformity and batch stability to ensure the high reliability and long-term consistency of copper-aluminum alloy targets in scientific research, industrial applications, and electronic device thin film preparation.

Chemical Formula: CuAl
Appearance: Dense target material, silver-gray to metallic gray

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

Documents

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