Copper nitride powder is a high-purity functional material primarily used in electronic devices, conductive coatings, and materials research to achieve stable performance and uniform film layers.
We offer copper nitride powder products in various particle sizes and purity grades, supporting customized packaging and technical support. Please contact us for samples and solutions.
High Purity
Uniform Particle Size and Controllable Distribution
Low Impurity Content
Good Chemical Stability
Easy Subsequent Processing and Sintering
High Batch Stability
Suitable for Scientific Research and Industrial Applications
Semiconductors and Electronic Devices: Copper nitride powder can be used in P-type semiconductor materials and thin film deposition to improve device conductivity and stability.
Functional Conductive Coatings: Used for conductive film deposition on glass, ceramic, or polymer surfaces to improve material conductivity and surface uniformity.
Materials Synthesis and Chemical Research: As a raw material or precursor for chemical reactions, it allows for control of material properties and reaction rates, facilitating research and development.
Industrial Functional Material Development: Suitable for the development of wear-resistant, corrosion-resistant, or specialty materials, providing a reliable powder base for industrial-scale applications.
Q1: Is copper nitride powder stable and easy to store?
A1: It remains stable for a long time under dry, light-proof, and sealed conditions. Avoid moisture or high-temperature environments.
Q2: How does powder particle size affect applications?
A2: Particle size affects sintering performance, film deposition uniformity, and reactivity. Selection should be based on specific processes.
Q3: Can it be used for small-batch scientific research experiments?
A3: Yes, we provide small-batch supply to support scientific research and laboratory development.
Q4: Do you support customized powder specifications?
A4: Yes, we can customize particle size, purity, and packaging according to customer equipment and process requirements.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We focus on the research and supply of high-purity functional powder materials, ensuring that each batch of copper nitride powder maintains a high degree of consistency in particle size, purity, and chemical stability, providing reliable assurance for scientific research, industrial, and thin film applications.
Chemical Formula: Cu₃N
Molecular Weight: 116.55 g/mol
Appearance: Dark brown to black powder
Density: 6.0 g/cm³
Crystal Structure: Cubic, anti-ReO₃ type
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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