ULPMAT

Copper Metal

Chemical Name:
Copper Metal
Formula:
Cu
Product No.:
2900
CAS No.:
7440-50-8
EINECS No.:
231-159-6
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
2900ST001 Cu 99.99% Ø 25.4 mm x 3.175 mm Inquire
2900ST002 Cu 99.999% Ø 25.4 mm x 3.175 mm Inquire
2900ST003 Cu 99.99% Ø 25.4 mm x 6.35 mm Inquire
2900ST004 Cu 99.999% Ø 25.4 mm x 6.35 mm Inquire
2900ST005 Cu 99.99% Ø 50.8 mm x 3.175 mm Inquire
2900ST006 Cu 99.999% Ø 50.8 mm x 3.175 mm Inquire
2900ST007 Cu 99.99% Ø 50.8 mm x 6.35 mm Inquire
2900ST008 Cu 99.999% Ø 50.8 mm x 6.35 mm Inquire
2900ST009 Cu 99.999% Ø 54 mm x 3 mm Inquire
2900ST010 Cu 99.99% Ø 76.2 mm x 3.175 mm Inquire
2900ST011 Cu 99.999% Ø 76.2 mm x 3.175 mm Inquire
2900ST012 Cu 99.99% Ø 76.2 mm x 6.35 mm Inquire
2900ST013 Cu 99.999% Ø 76.2 mm x 6.35 mm Inquire
2900ST014 Cu 99.999% Ø 101.6 mm x 6.35 mm Inquire
2900ST015 Cu 99.999% Ø 101.6 mm x 6.35 mm Inquire
2900ST016 Cu 99.99% Ø 127 mm x 6.3 mm Inquire
2900ST017 Cu 99.999% Ø 127 mm x 6.3 mm Inquire
2900ST018 Cu 99.99% Ø 152.4 mm x 3.175 mm Inquire
2900ST019 Cu 99.999% Ø 152.4 mm x 3.175 mm Inquire
Product ID
2900ST001
Formula
Cu
Purity
99.99%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
2900ST002
Formula
Cu
Purity
99.999%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
2900ST003
Formula
Cu
Purity
99.99%
Dimension
Ø 25.4 mm x 6.35 mm
Product ID
2900ST004
Formula
Cu
Purity
99.999%
Dimension
Ø 25.4 mm x 6.35 mm
Product ID
2900ST005
Formula
Cu
Purity
99.99%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
2900ST006
Formula
Cu
Purity
99.999%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
2900ST007
Formula
Cu
Purity
99.99%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
2900ST008
Formula
Cu
Purity
99.999%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
2900ST009
Formula
Cu
Purity
99.999%
Dimension
Ø 54 mm x 3 mm
Product ID
2900ST010
Formula
Cu
Purity
99.99%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
2900ST011
Formula
Cu
Purity
99.999%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
2900ST012
Formula
Cu
Purity
99.99%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
2900ST013
Formula
Cu
Purity
99.999%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
2900ST014
Formula
Cu
Purity
99.999%
Dimension
Ø 101.6 mm x 6.35 mm
Product ID
2900ST015
Formula
Cu
Purity
99.999%
Dimension
Ø 101.6 mm x 6.35 mm
Product ID
2900ST016
Formula
Cu
Purity
99.99%
Dimension
Ø 127 mm x 6.3 mm
Product ID
2900ST017
Formula
Cu
Purity
99.999%
Dimension
Ø 127 mm x 6.3 mm
Product ID
2900ST018
Formula
Cu
Purity
99.99%
Dimension
Ø 152.4 mm x 3.175 mm
Product ID
2900ST019
Formula
Cu
Purity
99.999%
Dimension
Ø 152.4 mm x 3.175 mm

Copper Metal Sputtering Target Overview

Copper metal sputtering targets are high-purity metal targets primarily used in thin film deposition processes to prepare stable conductive thin films in the semiconductor, display, and functional coating fields.

We can provide copper target solutions in various specifications and purities to meet different sputtering equipment and process requirements. Please contact us for customized parameters and technical support.

Product Highlights

High-purity metallic copper raw material
Uniform composition, low impurity content
Stable sputtering rate
Excellent thin film adhesion
Good electrical and thermal conductivity
Compatible with various sputtering systems
Supports customized sizes and shapes

Applications of Copper Metal Sputtering Target

Semiconductor interconnect layer fabrication: Used in integrated circuit manufacturing to form highly conductive metal interconnect films, meeting the stability and consistency requirements of micro-circuits.
Display and touch devices: Widely used in LCD, OLED, and touch panels as conductive or functional metal layers to improve the electrical performance of display components.
Functional conductive coatings: Suitable for conductive coating deposition on glass, ceramic, and polymer substrates for electromagnetic shielding or heating film structures.

FAQs

Q1: Is a copper sputtering target suitable for DC or RF sputtering?
A1: Due to copper’s excellent conductivity, it is generally more suitable for DC sputtering processes, achieving higher deposition efficiency and film uniformity.

Q2: How much does target purity affect film performance?
A2: Purity directly affects the resistivity and reliability of the film. High-purity copper targets help reduce impurity introduction and improve device stability.

Q3: Does a copper target require special storage during use?
A3: It is recommended to store it in a dry, sealed environment, avoiding prolonged exposure to humid air to reduce surface oxidation.

Q4: Can targets be customized according to equipment size?
A4: Yes, we support custom processing of round, rectangular, and irregularly shaped copper targets to match different sputtering systems.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We focus on a stable supply of metal sputtering materials and control over technical consistency. From raw material selection to processing and testing, we follow strict standards to provide customers with reliable and traceable copper sputtering targets, which helps ensure the long-term stable operation of thin film processes.

Chemical Formula: Cu
Molecular Weight: 63.55 g/mol
Appearance: Metallic luster, brass-colored solid target
Density: 8.96 g/cm³
Melting Point: 1,085 °C
Boiling Point: 2,562 °C
Crystal Structure: Face-Centered Cubic (FCC)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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