Ruthenium metal sputtering targets are thin film deposition materials made from high-purity ruthenium metal through melting, forging, rolling, and finishing. They possess excellent chemical inertness, stability, and electrical conductivity, and are widely used in semiconductor manufacturing, optoelectronic thin films, resistive film materials, hard coatings, and precision electronic devices. With their high density, low impurity content, and good sputtering efficiency, these targets are an essential component of advanced thin film preparation.
We can provide high-purity Ruthenium sputtering targets in various shapes, sizes, and densities, and support OEM and special specifications for research projects. Please contact us.
High-purity ruthenium metal
High density, stable sputtering rate
Multiple sizes and geometries available
Extremely low impurity content, suitable for high-end thin films
Uniform microstructure, reliable target performance
Custom backplane support (Bonding Service)
Long-term bulk supply available
Safe global shipping, traceable quality
Used for preparing conductive thin films and barrier layers in microelectronic devices.
Applied to the deposition of magnetic recording materials and data storage thin films.
As a key functional target for optoelectronic devices and sensor thin films.
Used for hard coatings, wear-resistant films, and surface-enhancing thin film systems.
Q1: Can the processing method of Ruthenium sputtering targets be customized?
A1: Yes, we offer different preparation methods such as hot isostatic pressing (HIP), vacuum melting, cold rolling, and machining, and can customize shapes and sizes according to requirements.
Q2: What are the special requirements for target storage and transportation?
A2: It is recommended to keep the original packaging sealed, store in a dry environment, and avoid collisions with hard objects. Precious metal sputtering targets offer excellent corrosion resistance, but surface scratches must be prevented from affecting sputtering stability.
Q3: What are the advantages of ruthenium sputtering targets compared to ordinary metal sputtering targets?
A3: Ruthenium sputtering targets possess more stable chemical inertness, a higher melting point, and a lower risk of impurity migration, making them suitable for demanding microelectronic and semiconductor thin film applications.
Q4: Do you provide sputtering backplane bonding services?
A4: We can provide diffusion bonding services using Mo, Cu, or Al as backplanes to improve target heat dissipation and sputtering life, and support customer-drawn drawing processing.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports are available upon request.
Possessing mature precious metal sputtering target manufacturing technology, we can guarantee the stable density, uniform structure, and reliable performance of our targets.
We offer a complete sputtering target delivery system, from raw material control to precision processing and final testing, ensuring traceability for every batch.
We respond quickly to customer needs, providing technical support, design advice, sample supply, and bulk stock preparation services.
With extensive international shipping experience, our secure and robust packaging ensures fast and complete delivery of targets worldwide.
We are committed to providing high-stability, high-purity precious metal sputtering target solutions for thin-film technology, semiconductor companies, and research institutions.
Chemical Formula: Ru
Atomic Weight: 101.07 g/mol
Appearance: Silver-gray metallic block, disk, or rectangular target
Density: 12.37 g/cm³ (solid)
Melting Point: 2334 °C
Boiling Point: 4150 °C
Crystal Structure: Hexagonal Close-Packed (HCP)
Hardness: Mohs hardness approx. 6.5
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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