Aluminum nitride ceramics are precision-formed components made from high-purity AlN powder through uniaxial or isostatic pressing followed by controlled sintering. It exhibits exceptional thermal conductivity, electrical insulation, and mechanical strength, making them ideal for demanding electronic, power device, and thermal management applications.
We offer Aluminum nitride ceramics dry-pressed parts in a variety of shapes and sizes, from simple discs and plates to complex custom geometries. All parts are formed from ≥99.9% pure aluminum nitride powder, optimized for high sintered density and minimal grain boundary impurities.
Purity: ≥99.9% AlN
Low Dielectric Loss and High Breakdown Voltage
Excellent Strength and Hardness
Compatible with metallization (e.g., Mo-Mn, W, Ag, Cu)
Custom dimensions and complex geometries available
Power Electronics: Substrates and heat spreaders for IGBT, MOSFET, and SiC devices
LED & Laser Packaging: Excellent heat dissipation for high-luminance LED modules
High-Frequency Components: Low-loss dielectric for RF/microwave circuits
Metallized Ceramics: For DBC/AMB substrates and hermetic packaging
Thermal Management: Baseplates and insulating layers in cooling systems
Custom Engineered Parts: Valves, spacers, washers, discs, and rings for harsh environments
Dry Pressing: Uniaxial or isostatic pressing up to several tons
Sintering: Pressureless sintering or hot pressing (on request)
Machining: CNC post-machining for high precision (holes, channels, surface finish)
Metallization: Mo-Mn, Ag, or W metallization compatible
Tolerance: Standard tolerance ±0.1 mm; precision options available
High-Purity Raw Material: Guaranteed ≥99.9% AlN powder
Controlled Microstructure: Uniform grain size and dense sintering
Advanced Forming: High-pressure pressing for low porosity and dimensional precision
Custom Fabrication: Prototyping to mass production supported
Metallization Support: Compatibility with your downstream bonding process
Global Shipping: Safe, moisture-protected packaging with full export documentation
Chemical Formula AlN
Appearance Gray-white to light gray ceramic
Density (sintered) ≥3.2 g/cm³
Thermal Conductivity ≥170 W/m·K
Dielectric Strength ≥15 kV/mm
Volume Resistivity ≥10¹² Ω·cm
Flexural Strength ≥300 MPa
Hardness (Vickers) ~1000 HV
Thermal Expansion Coefficient ~4.5 × 10⁻⁶ /K
Not classified as hazardous
Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.
Outer packaging: Carton or wooden box, depending on size and weight.
Fragile targets: Special protective packaging is used to ensure safe transport.
If you need any service, please contact us
