ULPMAT

Bismuth Antimonide

Chemical Name:
Bismuth Antimonide
Formula:
BiSb
Product No.:
835100
CAS No.:
12323-19-2
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
835100ST001 BiSb 99.99% Ø 25.4 mm x 3.175 mm Inquire
835100ST002 BiSb 99.99% Ø 50.8 mm x 3.175 mm Inquire
835100ST003 BiSb 99.99% Ø 50.8 mm x 6.35 mm Inquire
835100ST004 BiSb 99.99% Ø 76.2 mm x 3.175 mm Inquire
835100ST005 BiSb 99.99% Ø 101.6 mm x 3.175 mm Inquire
Product ID
835100ST001
Formula
BiSb
Purity
99.99%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
835100ST002
Formula
BiSb
Purity
99.99%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
835100ST003
Formula
BiSb
Purity
99.99%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
835100ST004
Formula
BiSb
Purity
99.99%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
835100ST005
Formula
BiSb
Purity
99.99%
Dimension
Ø 101.6 mm x 3.175 mm

Bismuth Antimonide sputtering target Overview

Bismuth Antimonide sputtering targets are alloy materials designed for high-performance thin film deposition processes and are often used in cutting-edge applications such as topological insulators, thermoelectric devices, and infrared detectors. The target combines the unique properties of bismuth and Antimonide, has good film quality, stable physical properties, and excellent band regulation capabilities, and is suitable for the research and development and production of complex thin film structures.

We provide Bismuth Antimonide targets in a variety of shapes and sizes, including round, rectangular, etc., and can be customized according to your specific ratio requirements. In addition, we provide you with comprehensive technical support and after-sales service. If you have any questions, please feel free to contact us.

Product highlights

Adjustable alloy ratio
High purity: 99.99%
High density to ensure uniform film formation and firm bonding
Excellent thermal stability and conductivity
Customizable size, shape and composition ratio
Supports grinding and polishing or backplane bonding (such as copper backplane)

Application of Bismuth Antimonide sputtering target

Topological insulator material research: BiSb is a typical topological insulator material used for electronic structure and spin transport property research.
Thermoelectric devices: used as thermoelectric materials in medium and low temperature thermoelectric modules, with high Seebeck coefficient and low thermal conductivity.
Infrared detection and sensors: suitable for infrared sensing coatings and low temperature sensitive components.
Advanced microelectronic materials: used to build key layers of special bandgap materials and heterojunction structures.

Reports

Each batch of BiSb sputtering targets is accompanied by a certificate of analysis (COA), material safety data sheet (MSDS) and related test reports. We support third-party testing to ensure that the materials meet international quality standards and help your research and mass production projects.

Molecular formula: BiSb
Molecular weight: about 216 g/mol
Appearance: gray metal target, dense and flat surface
Density: about 9.8 g/cm³ (close to theoretical density)
Melting point: about 570 °C (low melting point, suitable for low-temperature deposition)
Crystal structure: rhombohedral structure (R-3m)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

SKU 835100ST Category Brand:

Documents

No PDF files found.

Contact Us

If you need any service, please contact us

More Information

more products

CONTACT US

Thermal Spray

Our website has been completely upgraded